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European Innovation Council

EIC Multi-Corporate Day on Semiconductors & Embodied AI @ Hello Tomorrow Summit

EIC awardees are invited to a business acceleration opportunity culminating in the EIC Multi-Corporate Day on Semiconductors and Embodied AI with Air Liquide Venture Capital (ALIAD), Infineon, NXP, Stellantis, and STMicroelectronics. 

  • Partner meetings

The EIC-backed companies selected to take part in this initiative will receive tailored business support before they partake in an exclusive pitching and matching session with corporate experts and decision-makers in Amsterdam (Netherlands) on 12 June 2026, as part of a dedicated EIC Multi-Corporate Day side activity at the Hello Tomorrow Global Summit 2026.

Learn more via the open call. 

  • semiconductor
  • Friday 12 June 2026, 08:00 - 19:00 (CEST)
  • Amsterdam, Netherlands

Practical information

When
Friday 12 June 2026, 08:00 - 19:00 (CEST)
Where
NDSM
NDSM-Plein 90C, Amsterdam, Netherlands
Who should attend
EIC awardees, corporations in semiconductors and embodied AI
Languages
English
Part of
Website
Open call