- Publication date
- Opening date
- Deadline date
- European Innovation Council and SMEs Executive Agency
EISMEA publishes new tender for the future EIC International Trade Fairs and USA Soft-landing Programme 3.0.
Based on the success of previous similar programmes: OTF 1.0 (2016-2019) and OTF 2.0 (2020-2023), this new programme legally supported on the EIC work programme 2023, aims at supporting the commercialisation strategy of selected EIC-funded companies in European and foreign markets, create and implement soft-landing activities for EIC beneficiaries in United States of America and strengthen the EU innovation brand around the world.
The successful contractor will provide services such as securing an exhibition space/‘European-EIC Pavilion’ in international trade fairs, providing dedicated training sessions for the participating companies, company promotion and organisation of networking side events and sessions.
Deadline for applications: 07 August 2023, at 10:00 CET.