![EIC International Trade Fairs and USA Soft-landing Programme 3.0 Apply by 7 August 2023!](/sites/default/files/styles/oe_theme_medium_no_crop/public/2023-06/EIC%20International%20Trade%20Fairs%20%26%20USA%20Soft-landing%20Programme%203.0%20v2.png?itok=yBjqC3q2)
EISMEA launched new tender for the future EIC International Trade Fairs and USA Soft-landing Programme 3.0.
The objective of this action is to support the commercialisation strategy of selected EIC-funded companies in European and foreign markets, create and implement soft-landing activities for EIC beneficiaries in United States of America and strengthen the EU innovation brand around the world.
For further information, please visit the dedicated call webpage.
Details
- Publication date
- 13 June 2023