EISMEA launched new tender for the future EIC International Trade Fairs and USA Soft-landing Programme 3.0.
The objective of this action is to support the commercialisation strategy of selected EIC-funded companies in European and foreign markets, create and implement soft-landing activities for EIC beneficiaries in United States of America and strengthen the EU innovation brand around the world.
For further information, please visit the dedicated call webpage.
- Publication date
- 13 June 2023